Qualcomm Snapdragon 775 Details Leak
Check Also: Qualcomm Unveils Snapdragon Sound for High-quality Wireless Audio According to the leaks, the chipset will have Kryo 6xx cores, but that could mean anything. The above picture contains that the chipset will be fabbed on a 5nm process like the 888, and will support 3200MHz LPDDR5 and 2400MHz LPDDR4X RAM, as well as UFS 3.1 Two-Lane HS Gear 4. Moreover, the Spectra 570 ISP has support for 4K60 video recording, and three 28MP sensors working at the same time, as well as 64+20MP at 30fps. Connectivity-wise, the chipset will include Wi-Fi 6E with 2×2 MIMO, Bluetooth 5.2 (codenamed Milan), LTE Cat.18, Dual 5G, mmWave 5G, SA and NSA support, VoNR and NR CA, supporting 4×4 MIMO on the downlink and 2×2 MIMO on the uplink for Sub-6 5G. Sub-6 will work with FDD under 3 GHz and TDD in bands n77, n78, and n79. The Snapdragon 775 will also have the WCD9380/WCD9385 audio chip. According to some previously leaked AnTuTu scores, the 775 should perform much better than its predecessor, and all of these specs are rather important upgrades. Source: GSMArena
